Yi-Chao Chen
Associate Professor, Shanghai Jiao Tong University
yichao [at] sjtu.edu.cn
800 Dongchuan Road, SEIEE Building 3, Rm 505, Shanghai, China
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I join Shanghai Jiao Tong University as a tenure-track Associate Professor in the Department of Computer Science and Engineering in 2018. I received my B.S. and M.S. in the Department of Computer Science and Information Engineering at National Taiwan University in 2004 and 2006, respectively. I got my Ph.D. in Computer Science at the University of Texas at Austin in 2015. Prior to joining SJTU, I spent a year as a Researcher in Huawei Future Network Theory Lab in Hong Kong and then worked as a Chief Scientist in Hauoli LLC.
My research interests focus on networked systems and span the areas of mobile computing, wireless networking, and cyber-security.
news
| ICLAgent and OmniSch are accepted by ECCV 2026. | |
| LMM4-IC4K is accepted by ICML 2026. | |
| Work on single-chain analog backscatter tag is accepted by SenSys 2026. | |
| BIND is accepted by ACM Web Conference 2026. | |
| VibraGait is accepted by IEEE INFOCOM 2026. | |
| EMTap and OccMesh are published in ACM IMWUT 2025. | |
| MODepth is accepted by SIGGRAPH Asia 2025. | |
| SaDiF is accepted by ACM MobiHoc 2025. | |
| WDNN is accepted by ACM MobiCom 2025 (winter round). | |
| MIMSID is accepted by ACM MobiSys 2025. | |
| M2Silent is accepted by CHI 2025. | |
| Bridge and CGMM are accepted by ACM MobiCom 2025 (summer round). | |
| HandPad is accepted by UIST 2024. | |
| VISAR is accepted by IMWUT 2024. | |
| GPMS is accepted by ACM MobiCom 2024 (winter round). | |
| Two papers are accepted by ACM MobiSys 2024. | |
| MuDiS is accepted by ACM MobiCom 2024 (summer round). | |
| Our paper is accepted by IEEE ICC 2024. | |
| Our paper is accepted by ACM UbiComp/ISWC’23. | |
| PMSat is accepted by ACM MobiCom 2023. |
selected publication
- ECCVICLAgent: Integrated Circuit Footprint Geometry Labeling via LMM-empowered Multi-Agent FrameworkIn European Conference on Computer Vision (ECCV) , Malmo, Sweden, 2026
- ECCVOmniSch: A Multimodal PCB Schematic Benchmark For Structured Diagram Visual ReasoningIn European Conference on Computer Vision (ECCV) , Malmo, Sweden, 2026