Publications
2026
- ECCVICLAgent: Integrated Circuit Footprint Geometry Labeling via LMM-empowered Multi-Agent FrameworkIn European Conference on Computer Vision (ECCV) , Malmo, Sweden, 2026
- ECCVOmniSch: A Multimodal PCB Schematic Benchmark For Structured Diagram Visual ReasoningIn European Conference on Computer Vision (ECCV) , Malmo, Sweden, 2026
- INFOCOMVibraGait: Multi-User Gait Recognition based on Footstep-Induced Floor Vibrations via mmWaveIn IEEE Conference on Computer Communications (INFOCOM) , Tokyo, Japan, 2026
- TIFSExploiting Cyber Threat Intelligence for Indirect Attacks Against Serverless InfrastructuresIEEE Transactions on Information Forensics and Security, 2026
2025
- GETMOBILEMicroSurf: Guiding Energy Distribution inside Microwave Oven with MetasurfacesACM GetMobile: Mobile COmputing and Communication, 2025
- TMCMagSpy: Revealing User Privacy Leakage via Magnetometer on Mobile DevicesIEEE Transactions on Mobile Computing, 2025
- TMCMagicWrite: One-Dimensional Acoustic Tracking-Based Air Writing SystemIEEE Transactions on Mobile Computing, 2025
- IMWUTEMTap: Eavesdropping on Sound Transmitted via Audio Cables by Sensing Electromagnetic Variation Using RFIDACM Interactive, Mobile, Wearable and Ubiquitous Technologies (IMWUT), 2025
- IMWUTOccMesh: Occlusion-aware Multi-user 3D Human Mesh Reconstruction Using mmWave SignalsACM Interactive, Mobile, Wearable and Ubiquitous Technologies (IMWUT), 2025
2024
- UbiComp/ISWC
- UbiComp/ISWCTell Me How You Play: Exploring Ways to Enhance the Gaming Experience in Asymmetric Multiplayer VR Games through Affective State VisualizationIn ACM International Joint Conference on Pervasive and Ubiquitous Computing and International Symposium on Wearable Computers (UbiComp/ISWC Poster) , Melbourne, Australia, 2024
2023
- UbiComp/ISWCNon-Contact Thermal Haptics for VRIn ACM International Joint Conference on Pervasive and Ubiquitous Computing and International Symposium on Wearable Computers (UbiComp/ISWC) , Cancun, Quintana Roo, Mexico, 2023
- UbiComp/ISWC
2022
- UbiComp/ISWC